唐旻，教授，博士生导师，国家级高层次人才，上海市优秀学术带头人，IEEE MTT-S上海分会主席。近年来主持国家重点研发项目1项，国家自然科学基金项目3项（重点项目1项），主持其他科研项目30余项。发表SCI/EI论文200余篇，出版学术专著1部，登记软件著作权20项，授权发明专利15项。学术论文获得ACES2025、ISEDA2024、ISEDA2023、APEMC2017、EDAPS2015国际会议最佳论文/最佳学生论文奖及2019年度中国仿真学会“优秀论文奖”。代表性成果先后获得2019年上海市科学技术进步一等奖，2020年中国高等学校十大科技进展，2023年国家科学技术进步一等奖。

1.多物理场仿真技术和EDA工具

2.射频器件与互连封装结构建模

3.高性能/多功能封装天线设计

1.国家级高层次人才，2025

2.上海市优秀学术带头人，2023

3.国家科学技术进步一等奖，“射频系统设计自动化关键技术与应用”，2023

4.中国电子学会创新团队奖，2023

5.上海职工劳动和技能竞赛一等奖，“半导体异质集成电路项目”，2021

6.中国高等学校十大科技进展，“射频集成电路EDA关键技术与工具”，2020

7.上海市科学技术进步一等奖，“射频电路EDA的关键技术研发与应用”，2019

8.中国仿真学会“优秀论文奖”，2019

9.国家科学技术进步二等奖，“射频电子系统的三维高密度封装技术及其应用”，2012

10.上海市科学技术进步一等奖，“射频系统级封装技术及其应用”，2011

1. 微波技术，48学时，本科生课程，秋季

2. 高速电路系统的电路分析，32学时，研究生课程，春季

1. 毛军发，唐旻，高速集成电路互连，科学出版社，2017年。

2. 一种基于线性锥削缝隙形式的散热片天线阵结构，专利号：ZL202110794721.4，发明人：唐旻，钱佳唯，毛军发

3. 一种散热片天线阵结构，专利号：ZL201911008244.3，发明人：唐旻，钱佳唯，张跃平，毛军发

4. 一种基于阶梯阻抗传输线的键合线阻抗匹配方法，专利号：201810481356.X，发明人：唐旻，蒋万里，毛军发

5. 一种基于自适应更新基准值的光纤瞬断特性信息提取系统，专利号：ZL201611232711.7，发明人：蒋万里，唐旻

6. 一种用于光纤瞬断检测系统的宽带低噪声模拟前端电路，专利号：ZL201611232684.3，发明人：蒋万里，唐旻

7. 系统级封装电源完整性设计的混合网格划分方法，专利号：ZL201010523544.8，发明人：刘春天，毛军发，唐旻

[1]  Jie Li, Min Tang*, Jun-Fa Mao, “An Efficient ADI Method for Transient Thermal Simulation of Liquid-Cooled 3-D ICs,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 9, pp. 1484-1491, Sep. 2022.

[2]  Li Zhou, Min Tang*, Yue-Ping Zhang, Junfa Mao, “Electro-Thermal Design of SIW Slot Antenna Array with Fin-Shaped Heatsink Enclosed,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 9, pp. 1526-1532, Sep. 2022.

[3]  Qi Xiao, Min Tang*, Junfa Mao, Average Power Handling Capability of Microstrip Lines Considering Heat Convection and Self-Heating Effects with Temperature-Dependent Resistivity, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 5, pp. 760-768, May. 2022.

[4]  Jie Li, Min Tang*, Junfa Mao, Analytical Thermal Model for AlGaN/GaN HEMTs Using Conformal Mapping Method, IEEE Transactions on Electron Devices, vol. 69, no. 5, pp. 2313-2318, May. 2022.

[5]  Li Zhou, Min Tang*, Jiawei Qian, Yao-Ping Zhang, Junfa Mao, Vivaldi Antenna Array with Heat Dissipation Enhancement for Millimeter-Wave Applications, IEEE Transactions on Antennas and Propagation, vol. 70, no. 1, pp. 288-295, Jan. 2022.

[6]  Meini Wang, Min Tang*, Le Peng Zhang, Hao Chi Zhang*, Jie Xu, Tie Jun Cui, Junfa Mao, Miniaturization of Frequency-Reconfigurable Antenna Using Periodic Slow-Wave Structure, IEEE Transactions on Antennas and Propagation, vol. 69, no. 11, pp. 7889-7894, Nov. 2021.

[7] Min Tang, Liang Chen*, Bo Li, Haikun Yue, Yang Tang, Junfa Mao, Nonlinear Thermal Analysis of AlGaN/GaN HEMTs with Temperature-Dependent Parameters, IEEE Transactions on Electron Devices, vol. 68, no. 9, pp. 4565-4570, Sep. 2021.

[8]  Le Peng Zhang, Hao Chi Zhang*, Wenxuan Tang, Chenzi Shao, Pei Hang He, Min Tang*, Junfa Mao, Tie Jun Cui*, A Broadband 90° Balun With Low-Phase-Imbalance Performance Based on Periodic Slow Wave Structure, IEEE Transactions on Antennas and Propagation, vol. 69, no. 8, pp. 4681-4687, Aug. 2021.

[9]  Jiawei Qian, Hao-Ran Zhu, Min Tang*, Junfa Mao, A 24 GHz Microstrip Comb Array Antenna with High Sidelobe Suppression for Radar Sensor, IEEE Antennas and Wireless Propagation Letters, vol. 20, no. 7, pp. 1220-1224, Jul. 2021.

[10] Jiawei Qian, Min Tang*, Yao-Ping Zhang, Junfa Mao, Heatsink Antenna Array for Millimeter-Wave Applications, IEEE Transactions on Antennas and Propagation, vol. 68, no. 11, pp. 7664-7669, Nov. 2020.

[11] Meini Wang, Min Tang*, Hao-Chi Zhang, Le-Peng Zhang, Tie-Jun Cui, Junfa, Mao, Crosstalk Noise Suppression Between Single and Differential Transmission Lines Using Spoof Surface Plasmon Polaritons, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 8, pp. 1367-1374, Aug. 2020.

[12] Ping Li*, Min Tang*, Zhi Xiang Huang, Li Jun Jiang, Hakan Bağcı, DC IR-Drop Analysis of Multilayered Power Distribution Network by Discontinuous Galerkin Method With Thermal Effects Incorporated, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 6, pp. 1035-1042, Jun. 2020.

[13] Bo Li, Min Tang*, Haikun Yue, Yang Tang, Junfa Mao, Efficient Transient Thermal Simulation of ICs and Packages With Laguerre-Based Finite-Element Method, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 2, pp. 203-211, Feb. 2020.

[14] Jiawei Qian, Min Tang*, Yao-Ping Zhang, Junfa, Mao, Heatsink Antenna Array for Millimeter-Wave Applications, IEEE Transactions on Antennas and Propagation, vol. 68, no. 11, pp. 7664-7669, Nov. 2020.

[15] Ping Li, Li Jun Jiang, Min Tang, Yao Jiang Zhang, Shuai Xu, Hakan Bağcı, A Novel Subdomain 2D/Q-2D Finite Element Method for Power/Ground Plate-Pair Analysis, IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 5, pp. 2217 - 2226, Oct. 2020.

[16] Meini Wang, Min Tang*, Hao-Chi Zhang, Le-Peng Zhang, Tie-Jun Cui, Junfa, Mao, Crosstalk Noise Suppression Between Single and Differential Transmission Lines Using Spoof Surface Plasmon Polaritons, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 8, pp. 1367-1374, Aug. 2020.

[17] Ping Li, Min Tang, Zhi Xiang Huang, Li Jun Jiang, Hakan Bağcı, DC IR-Drop Analysis of Multilayered Power Distribution Network by Discontinuous Galerkin Method With Thermal Effects Incorporated, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 6, pp. 1035-1042, Jun. 2020.

[18] Bo Li, Min Tang*, Haikun Yue, Yang Tang, Junfa Mao, Efficient Transient Thermal Simulation of ICs and Packages With Laguerre-Based Finite-Element Method, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 2, pp. 203-211, Feb. 2020.