[1] Guangcao Fu, Min Tang, Qiangqiang Feng, Peng Bian, Jun-Fa Mao, Fast transient electro-thermal simulation of on-chip interconnects in the presence of ESD pulses, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS, p 166-169, 2015. (Best Paper Award)
[2] N. Li, Jun-Fa Mao, W.-S. Zhao, Wen-Yan Yin, “Electrothermal characteristics of carbon-based through silicon via (TSV) channel,” IEEE Elect. Design Adv. Packag. Syst. Symp., 2015. (Best Student Paper Award)
[3] Guang-Cao Fu, Min Tang, Jun-Fa Mao, A Comparative Study of MoC and FDTD Methods for Time-Domain Simulation of Transmission Lines, Asia-Pacific Microwave Conference, APMC, 2015.
