[1] Zhi-Hao Zhao, Lin-Sheng Wu, and Jun-Fa Mao, “Ka-band stacked patch antenna array on multilayer silicon interposer for three-dimensional integration,” Int. Conf. Microw. Millimeter Wave Technol., Qingdao, China, May 2023. (best student paper award)
[2] Jie Li, Min Tang, and Junfa Mao, “A GPU-accelerated ADI method for thermal simulation of liquid-cooled 3-D ICs,” International symposium of EDA (ISEDA), Nanjing, Chinam May, 2023. (Best paper award)
